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TP250 Series Thermally Conductive Gap Filler can through the different parameters can easily complete the thermal conductivity and bonding , sealing, filling gaps , shock absorption, sound-absorbing design purpose, while reducing assembly costs and improve the efficiency of the manufacturing process.

Dispensable Thermal Pads for Advanced Electronics

Features:
-High thermal conductivity
-High conformability and cost effective
-Naturally tacky needing no additional adhesive coating
-Electrically insulating

MATERIALS BENEFITS
• Good thermal performance with reduced interfacial thermal resistance
• Noise/vibration dampening
• Shock absorbing
• Both sides compressible
• No interference or delamination
• Easy handling with no elongation
• Flame retardant

MATERIALS APPLICATIONS

    •Between electronic components such as Semiconductors, Integrated Circuits, Central Processing Units, Metal Oxide
Semiconductors, Metal Core and FR4 Boards, Solid State Drives, and Heat Sinks.
   • LED Lighting, LED Drivers, Telecom Devices, Wireless Hubs, Power Supplies, High End Displays, etc.
   • Cooling & Thermal Modules and in all applications where a metal housing is used as a Heatsink.

We are manufacturer specialize in thermal gap pad interface materials, we offer very reasonable price and good quality products for our customers. If you have more questions about our products and thermal management solutions, please do not hesitate to contact us by Email：sales@sg-alibaba.com.