Thermal Interface Materials
Thermal interface materials can be used in a wide range of electronic products ranging from automotive electronics, telecom, consumer, lighting, military, medical, power supplies, wireless, personal computer, LED, LCD TV, motherboard, DRAM memory module, cooler, vehicle control module, notebook computer etc…wherever there is thermal management issues Our products can provide a cost-efficient and manufacturing-friendly solution.
They take many forms. The most common is the white-colored paste or thermal grease, typically silicone oil filled with aluminum oxide, zinc oxide, or boron nitride. Some brands of thermal interfaces use micronized or pulverized silver.
Another type of TIMs are the phase-change materials. These are solid at room temperature but liquefy and behave like grease at operating temperatures. They are easy to handle and are not messy.
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With the high packing density of power semiconductors, transistor chips and discrete components, etc., the generated heat has to be conducted away as efficiently as possible. Our Company has solutions for almost every type of heat problem and application by offering films, adhesive tapes, thermal grease, gap fillers and other materials.
Thermal interfacial materials (TIMs) are thermally conductive materials, which are applied to increase thermal contact conductance across jointed solid surfaces, such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. These gaps are normally filled with air which is a very poor conductor.
Without thermal interface material, the heat flow go through joint face slowly, and the thermal conductive performance is bad.
Using thermal interface material to link two joint faces, the heat flow go through equally, and the thermal conductive performance is good.
Most electronic such as power transistors, CPUs and power diodes produce a significant amount of heat and measures may be necessary to take account of this in order to prolong their working life and increase reliability.
The surface of a CPU or a heatsink is never entirely flat; if you place a heatsink directly on a CPU, there will be tiny (invisible) gaps between the two. Since air conducts heat poorly, these gaps have a very negative effect on the heat transfer. Therefore, an interface material with a high thermal conductivity is needed to fill these gaps, and thus improve heat conductivity between CPU and heatsink.
An interface material enhances the thermal contact between imperfect mating surfaces. A highly thermally conductive material, with good surface wetting ability, will reduce interfacial resistance. We make available for our clients a top-of-the-line range of Thermal Pad which is mainly used in electronic devices and heat sinks or product transfer interface between the enclosures. Our product is known to be a special type of chemical that greatly improves heat transfer as well as the cooling of the processor.
Including innovating, research and development, manufacture and sale. Our company hold the opinion about the "honest carry on, satisfying customer, Our Company specializes in OEM/ODM services tailoring products to customers' requirements, positive innovation and group cooperation" .in order to expect to supply perfect service for customer, and aspire to sustainable carry on of the goal.
Thermal conductivity is a bulk property that describes the ability of a material to transfer heat. Thermal conductivity of materials plays a significant role in the cooling of electronics equipment. From the die where the heat is generated to the cabinet where the electronics are housed, conduction heat transfer and, subsequently, thermal conductivity are the integral components of the overall thermal management process. The most common thermal conductivity test method is ASTM D5470: Linear Rod Method.
For over 10 years, We have been the global leader in silicone thermal interface materials , advancing purity and quality standards while redefining expectations in customer care.
Our thermal pad can be used over 20 years. Generally, the working life of materials depends on the working life of silicone rubber. And the shelf life for thermal gap pad is one (1) year after date of manufacture. For thermal gap pad with adhesive, the shelf life is six (6) months after the date of manufacture. After these dates, inherent tack and adhesive properties should be recharacterized.
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