TP 200 series materials combines good thermal conductivity of 2.0 W/m-K with high compressibility to produce low thermal resistance.
Features:
-High thermal conductivity 2.0
-Good conformability and cost effective
-Naturally tacky
-Electrically insulating
-Meets UL 94 V0 rating, stable from -40°C to 150°C
Applications:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
We are manufacturer specialize in thermal gap pad interface materials, we offer very reasonable price and good quality products for our customers. If you have more questions about our products and thermal management solutions, please do not hesitate to contact us by Email:sales@sg-alibaba.com.
Thermal Interface Materials
Address: Baoan District, Shenzhen City, China
Tel: (86)-755-28085431
Fax: (86)-755-28085431
E-mail: Sales@sg-alibaba.com
Sales Manager:
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